10G CWDM XFP,Optical Transceiver,10km SPT-XC(XX)TG-10D

Features

Supports 9.95Gb/s to 11.1Gb/s bit rates
Hot-pluggable XFP footprint
Maximum link length of 10km with SMF
4-Wavelengths Uncooled CWDM DFB laser from1270nm to 1330nm, with Step 20nm
XFP MSA package with duplex LC connector
No reference clock required
Compatible with RoHS
+3.3V power supply
Power dissipation <2.5W
Built-in digital diagnostic functions
Temperature range 0°C to 70°C

Applications

SDH STM I-64.1 at 9.953Gbps
10GBASE-LR/LW 10G Ethernet
1200-SM-LL-L 10G Fibre Channel
10GE over G.709 at 11.09Gbps
OC192 over FEC at 10.709Gbps
Other optical links, up to 11.1Gbps

Description

SPT-XC (XX) TG-10 is compliant with the 10G Small Form-Factor Pluggable (XFP) Multi-Source Agreement (MSA), supporting data-rate of 10.3125Gbps(10GBASE-LR) or 9.953Gbps 10GBASE-LW), and transmission distance up to 10km on SMF. The transceiver module comprises a transmitter with uncooled CWDM DFB laser and a receiver with a PIN photodiode. Transmitter and receiver are separate within a wide temperature range of 0℃ to +70℃and offers optimum heat dissipation and excellent electromagnetic shielding thus enabling high portdensities for 10 GbE systems.

Absolute Maximum Ratings

Parameter	Symbol	Min	Max	Unit	Ref.
Storage Ambient Temperature Range		-40	+85	℃
Powered case Temperature Range		0	+75	℃
Operating Relative Humidity	RH		80	％
Supply Voltage Range @ 3.3V	Vcc3	-0.5	4.0	V

Any stress beyond the maximum ratings can result in permanent damage. The device specifications are guaranteed only

under the recommended operating conditions.

Electrical Characteristics

Parameter		Symbol	Min	Typ	Max	Unit	Note
Operating Case Temperature Range		Tc	0		+70	℃
Power Supply Voltage @ 3.3V		Vcc3	3.13	3.3	3.47	V
Module total power		P			2.5	W
Transmitter
Input differential impedance		Rin		100		Ω	1
Differential data input swing		Vin,pp	120		820	mV
Transmit Disable Voltage		VD	2.0		Vcc	V
Transmit Enable Voltage		VEN	GND		GND+0.8	V
Transmit Disable Assert Time					10	us
Receiver
Differential data output swing	Vout,pp		500		850	mV
Data output rise time	tr				38	ps		2
Data output fall time	tf				38	ps		2
LOS Fault	VLOS fault		Vcc - 0.5		VccHOST	V		3
LOS Normal	VLOS norm		GND		GND+0.5	V		3
Power Supply Rejection	PSR		See Note 3 below					4

Notes:

1. After internal AC coupling.

2. 20 – 80 %

3. Loss Of Signal is open collector to be pulled up with a 4.7k – 10kohm resistor to 3.15 – 3.6V. Logic 0 indicates normal

operation; logic 1 indicates no signal detected.

4. Per Section 2.7.1. in the XFP MSA Specification.

Optical Characteristics

Parameter	Symbol	Min	Typ	Max	Unit	Ref.
Transmitter
Optical output Power	P	-6.5		+0.5	dBm
Optical Wavelength	λ	1270		1330	nm
Optical Extinction Ratio	ER	6			dB	1
Side Mode Suppression Ratio	SMSR	30			dB
Average Launch power of OFF transmitter	POFF	-30			dBm
Tx Jitter	Txj	Compliant with each standard requirements
Receiver
Receiver Sensitivity	RSENS		-16	-14.5	dBm	2
Receiver Sensitivity in OMA	RSENS			-12.5	dBm	2
Maximum Input Power	PMAX	+0.5			dBm
Optical Center Wavelength	λC	1260		1600	nm
LOS De-Assert	LOSD			-15	dBm
LOS Assert	LOSA	-25			dBm
LOS Hysteresis		1		4	dB

Notes:

1, PRBS 231-1 test pattern @10.3125Gbps.

2, PRBS 231-1 test pattern @10.3125Gbps, BER≤10-12.

Pin Descriptions

Pin	Logic	Symbol	Name/Description	Ref
1		GND	Module Ground	1
2		VEE5	Optional –5.2 Power Supply – Not required
3	LVTTL-I	Mod-Desel	Module De-select; When held low allows the module to , respond to 2-wire serial interface commands
4	LVTTL-O	Interrupt	Interrupt (bar); Indicates presence of an important condition which can be read over the serial 2-wire interface	2
5	LVTTL-I	TX_DIS	Transmitter Disable; Transmitter laser source turned off
6		VCC5	+5 Power Supply – Not required
7		GND	Module Ground	1

8		VCC3	+3.3V Power Supply
9		VCC3	+3.3V Power Supply
10	LVTTL-I	SCL	Serial 2-wire interface clock	2
11	LVTTL- I/O	SDA	Serial 2-wire interface data line	2
12	LVTTL-O	Mod_Abs	Module Absent; Indicates module is not present. Grounded in the module.	2
13	LVTTL-O	Mod_NR	Module Not Ready;	2
14	LVTTL-O	RX_LOS	Receiver Loss of Signal indicator	2
15		GND	Module Ground	1
16		GND	Module Ground	1
17	CML-O	RD-	Receiver inverted data output
18	CML-O	RD+	Receiver non-inverted data output
19		GND	Module Ground	1
20		VCC2	+1.8V Power Supply – Not required
21	LVTTL-I	P_Down/R ST	Power Down; When high, places the module in the low power stand-by mode and on the falling edge of P_Down initiates a module reset
21	LVTTL-I	P_Down/R ST	Reset; The falling edge initiates a complete reset of the module including the 2-wire serial interface, equivalent to a power cycle.
22		VCC2	+1.8V Power Supply – Not required
23		GND	Module Ground	1
24	PECL-I	RefCLK+	Reference Clock non-inverted input, AC coupled on the host board – Not required	3
25	PECL-I	RefCLK-	Reference Clock inverted input, AC coupled on the host board – Not required	3
26		GND	Module Ground	1
27		GND	Module Ground	1
28	CML-I	TD-	Transmitter inverted data input
29	CML-I	TD+	Transmitter non-inverted data input
30		GND	Module Ground	1

Notes:

1. Module circuit ground is isolated from module chassis ground within the module.

2. Open collector; should be pulled up with 4.7k – 10k ohms on host board to a voltage between 3.15Vand 3.6V.

3. A Reference Clock input is not required.

Host board Connector Pinout

General Specifications

Parameter	Symbol	Min	Typ	Max	Units	Ref.
Bit Rate	BR	9.95		11.1	Gb/s	1
Bit Error Ratio	BER			10-12		2
Max. Supported Link Length	LMAX		10		km	1

Notes:

1. SONET OC-192 SR-1，SDH STM I-64.1 ,10GBASE-LR/LW, 1200-SM-LL-L

2. Tested with a 231 – 1 PRBS

Management Interface

The transceivers provide serial ID memory contents and diagnostic information about the present operating conditions by the 2-wire serial interface (SCL, SDA).

The Module provides diagnostic information about the present operating conditions. The transceiver generates this diagnostic data by digitization of internal analog signals. Alarm/warning threshold data is written during device manufacture. Received power monitoring, transmitted power monitoring, bias current monitoring, supply voltage monitoring and temperature monitoring all are implemented.

The digital diagnostic memory map specific data field defines as following.